Materials for High-Density Electronic Packaging and Interconnection

Status: Available Now

Size: 156 pages, 8.5 x 11

Publication Year:1990

Print	List Price


PAPERBACK ISBN-10: 0-309-04233-X ISBN-13: 978-0-309-04233-8	$19.00	Add to Cart

PDF			About PDF

Authors:
Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
Authoring Organizations

Paste into your Web page:

<!-- Start NAP Book Display -->
<object classid="clsid:d27cdb6e-ae6d-11cf-96b8-444553540000" codebase="http://download.macromedia.com/pub/shockwave/cabs/flash/swflash.cab#version=8,0,0,0" width="175" height="250" id="napbookwrapper" align="middle">
<param name="allowScriptAccess" value="always" />
<param name="movie" value="http://www.nap.edu/napbookwrapper.swf" />
<param name="quality" value="high" />
<param name="wmode" value="transparent" />
<param name="flashvars" value="wid=232019617920130524140815&record_id=1624" />
<embed src="http://www.nap.edu/napbookwrapper.swf" quality="high" flashvars="wid=232019617920130524140815&record_id=1624" wmode="transparent" bgcolor="#ffffff" width="175" height="250" name="napbookwrapper" align="middle" allowScriptAccess="always" allowFullScreen="false" type="application/x-shockwave-flash" pluginspage="http://www.macromedia.com/go/getflashplayer"></embed>
</object>

Preview

Free Resources

Full Text
Jump to this book's table of contents to begin reading online for free.

Related Items:
Related Titles

PDF Summary
Download the summary in PDF.

Reprint Permission
Request permission to license or reprint the book's content through Copyright Clearance Center's Rightslink.

Request Permission to Distribute a PDF

Request Translation Rights

Questions About Rights and Permissions?

Table of Contents
Select a link below to start reading online free!
FRONT MATTER	i-xiv	(skim)
EXECUTIVE SUMMARY	1-8	(skim)
1 INTRODUCTION	9-20	(skim)
2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS	21-40	(skim)
3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS	41-58	(skim)
4 MATERIALS ISSUES	59-70	(skim)
5 SOME SPECIFIC MATERIALS	71-94	(skim)
6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES	95-104	(skim)
APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT	105-108	(skim)
APPENDIX B: SOME INDUSTRY COMPONENT DATA	109-114	(skim)
APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS	115-118	(skim)
APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES	119-122	(skim)
APPENDIX E: MATERIALS PROPERTIES	123-126	(skim)
APPENDIX F: EXAMPLES OF MULTICHIP MODULES	127-134	(skim)
APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS	135-139	(skim)

Materials for High-Density Electronic Packaging and Interconnection

Citation Manager

Authoring Organizations

Search This Book

SIGN UP FOR...