Materials for High-Density Electronic Packaging and Interconnection

Materials for High-Density Electronic Packaging and Interconnection

(1990)

Paperback
156 pages | 8.5 x 11
978-0-309-04233-8

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Paperback
156 pages | 8.5 x 11
978-0-309-04233-8

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Authors

Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council

Suggested Citation

National Research Council. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press, 1990.

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