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PAPERBACK list:$19.00 Web:$17.10 add to cart PDF BOOK your price: $15.00 add to cart Rights & Permissions Free Resources PDF EXECUTIVE SUMMARY Display this book on your site! Related Titles Condensed-Matter and Materials Physics: The Science of the World Around Us Getting Up to Speed: The Future of Supercomputing Other Related Titles Materials for High-Density Electronic Packaging and Interconnection (1990) National Materials Advisory Board (NMAB) Web Search Builder Use this book's key terms to search within this book, across our collection, or across the Web. Skim This Chapter Skim this chapter and use this chapter's key terms to search within this book. Reference Finder Paste in your own text to find books that relate to your topic. Page 105   E-mail  Facebook  Digg  Stumble  Twitter More Page 105 FRONT MATTER (R1-R14) EXECUTIVE SUMMARY (1-8) 1 INTRODUCTION (9-20) 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS (21-40) 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS (41-58) 4 MATERIALS ISSUES (59-70) 5 SOME SPECIFIC MATERIALS (71-94) 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES (95-104) APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT (105-108) APPENDIX B: SOME INDUSTRY COMPONENT DATA (109-114) APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS (115-118) APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES (119-122) APPENDIX E: MATERIALS PROPERTIES (123-126) APPENDIX F: EXAMPLES OF MULTICHIP MODULES (127-134) APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS (135-139)

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OCR for page 105
Appendix A GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THIS REPORT BiCMOS - an integration of bipolar and complementary MOS devices on a single chip Blind via - a via that terminates only on one side of the board Buried via - a via that terminates on two buried planes CAD - computer-aided design CAM - computer-aided manufacturing Captive production - company in-house component production and consumption, not for outs ide sale CC - chip carrier Chip - diced semiconductor active element to be mounted (bonded) in a package ~ see " die " ~ CMOS - complementary metal- oxide - semiconductor COB - chip on board CPU - central processing unit C4 - controlled collapse chip connection CTE - coefficient of thermal expansion (~) (also see ''ICE" ~ Die - IC chip as cut (diced) from a finished wafer, to be mounted (bonded) in a package t see "chip"] DIP - dual in-line package DRAM - dynamic random access memory (' - real part of dielectric permitt~vity (E '/6O = k) 105

OCR for page 106
106 (" - imaginary part of dielectric permittivity SO - dielectric permittivity of free space ~ - dielectric constant fused interchangeably with k in the text j ECL - emitter-coupled logic EMI - electromagnetic interference FET - field effect transistor GaAs - gallium arsenide HTSC - high-temperature superconductor IC - integrated circuit I/O - inputs/outp~ts k - relative dielectric constant (if) [used interchangeably with Ej ~ - thermal conductivity MCM - multichip module MLB - mult~layer board MOS - metal-oxide-semiconductor MOSFET - metal-oxide-semiconduc~cr field effect transistor NAND - "not" I' end" (a logic circuit function designation' NMOS - n-channel metal-oxide-cemiconductor NOR - 'snot" tror" (a logic Air Chit function designation) PCB - printed circuit board [used interchangeably with EWE in the text PGA - p in grid array P-g'ass - phosphosilicate glass used for chip passi~ra~ion POP - b~pc~la' dove ce ~ ayer structure (hole-rich layer/electron-rich lay er~hole - rich layer) ~ bars Astor P-H - pi Ted through holes PUB - pro need wi.~ir~5 board fused interchangeably with PCB in the text

OCR for page 107
107 RIE - reactive ion etching RISC - reduced instruction set computer (or processor) SMA - surface -mount assembly SCM - single chip modules S RAM - static random access memory TAB - tape automated bonding TCE - thermal coefficient of expansion Acts [see "CTE" ~ Via - a conducting through path perpendicular to the plane of the substrate ~ see also blind via ~ NISI - wafer- scale integration

OCR for page 108

Representative terms from entire chapter:

effect transistor