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PAPERBACK list:$19.00 Web:$17.10 add to cart PDF BOOK your price: $15.00 add to cart Rights & Permissions Free Resources PDF EXECUTIVE SUMMARY Display this book on your site! Related Titles Condensed-Matter and Materials Physics: The Science of the World Around Us Getting Up to Speed: The Future of Supercomputing Other Related Titles Materials for High-Density Electronic Packaging and Interconnection (1990) National Materials Advisory Board (NMAB) Web Search Builder Use this book's key terms to search within this book, across our collection, or across the Web. Skim This Chapter Skim this chapter and use this chapter's key terms to search within this book. Reference Finder Paste in your own text to find books that relate to your topic. Page 109   E-mail  Facebook  Digg  Stumble  Twitter More Page 109 FRONT MATTER (R1-R14) EXECUTIVE SUMMARY (1-8) 1 INTRODUCTION (9-20) 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS (21-40) 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS (41-58) 4 MATERIALS ISSUES (59-70) 5 SOME SPECIFIC MATERIALS (71-94) 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES (95-104) APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT (105-108) APPENDIX B: SOME INDUSTRY COMPONENT DATA (109-114) APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS (115-118) APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES (119-122) APPENDIX E: MATERIALS PROPERTIES (123-126) APPENDIX F: EXAMPLES OF MULTICHIP MODULES (127-134) APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS (135-139)

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Appendix B S OME INDUS TRY COMPONENT DATA The three tables that follow contain some specific industry data from a copyrighted report "Chip Carriers and Other Integrated Circuit Packages: A Review and Update, 1988" prepared by Welterlen, Inc. for client companies. These data are fraction of the comprehensive analysis covered in these annual reports and are presented here with the kind permission of Dr. James W. Welterlen, President of Welterlen, Inc. The tables illustrate the complexity of the chip encapsulation situation. 109

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111 Table B-1 DISTRIBUTION OF PACKAGE TYPES* ACT 1987 92/87 92/87 EST 1992 UNIT UNITS ASP VALUE ANN GR ANN GR UNIT UNITS ASP VALUE X MIL ~mil S UNIT % VALUE % % MIL S MIL $ CH I P CARR I ERS: CERAMIC MULTILYR LDL£SS 1.15103.50 1.54159.39 7.65 9.42 1.10149.60 1.67249.95 CERAMIC ttiJLTILYR LEADED 0.3531.50 3.30103.95 45.30 40.51 1.50204.00 2.79569.32 CERAMIC SLAM LEADLESS 0.26 23. 13 O.39 8.91 8.01 9.60 0.25 34.00 0.41 14.08 CERAMIC SLAM LEADED 0.02 1.59 2.50 3.96 47.00 41. 12 O. 08 10.88 2.04 22.18 CERAMIC SLAM ARRAYS O .20 18. 00 0.33 5.94 35. 30 31. 65 0.60 81. 60 0. 29 23 .49 CERQUAD LEADED 0.23 21.0S 0.50 10.42 45.23 40.45 1.00 136.00 0.42 56.93 CERAMIC FINE PITCH 0. 03 2.29 13.50 30. 91 60.62 49.05 0.18 24.48 9.29 227.40 PLASTIC PREMOLDED LEADED 0.08 6.93 1 .30 9 .01 -39 .89 -34 . 18 O .00 O. 54 2. 05 1 . 11 PLASTIC POSTMOLD LEADED S.75 517.50 0.39 199.24 23.65 22.04 11.00 1496.00 0.36 539.33 PLASTIC QUAD FLAT PACK 0.11 10.17 0.75 7.63 121.65 101.26 4.00 544.00 0.46 251.85 PLASTIC LEADLESS 0.00 0.09 0.64 0.06 8.61 7.17 O. 00 O. 14 0.60 0.08 DUAL - I NL I NE - PACKAGE: CERAMIC SIDE BRAZE DIP 1.62 145.80 2.00 291.60 -4.54 -0.93 0.85 115.60 2.41 278.31 CERDIP 9.80 882.00 0.21 185.22 -4.69 -1.61 5.10 693.60 0.25 170.77 PLASTIC POSTMOLDED O}P 72. 50 6525. 00 0 . 09 574. 20 2.33 2.43 53 .84 7322 . 24 0. 09 647 .37 PIN GRID ARRAY: CERAMIC MULTILAYER 0.45 40.24 9.15 368.20 24.92 22.78 0.90 122.40 8.39 1027.39 CERAMIC SLAM 0.04 3.36 5.17 17.39 15.12 14.67 0.05 6.80 5.07 34.47 PLASTIC MIJLTILAYER 0.06 5.08 3.96 20.13 96.67 81.98 1.10 149.60 2.69 401.82 CERAMIC FLAT PACK 0.28 25.20 2.00 50.40 -11 .61 -6.95 0. 10 13.60 2.58 35. 15 PLASTIC SOIC ~ 55 499.50 C.15 74.93 30.96 25.64 14.15 1924.40 0.12 234.61 TAB 0.30 27.00 0.33 8.91 58.72 48.18 2.00 272.00 0.23 63.64 COB ~ . so 45. 00 0.26 11.70 24.76 20.20 1. 00 136.00 0.22 29.35 METAL PLATFORM TYPE 0.04 3.60 10.00 36.00 8.61 8.61 0.04 5.44 10.00 54.40 FETAL FLAT PACK TYPE 0.16 14.40 7.00 100.80 7.21 7.21 0.15 20.40 7.00 142.80 OTHER D. 53 47.70 - - - - 1.00 136. 00 ALL CC 8. 17 735. 74 ~ .73 539 .41 29.52 29.38 19. 72 2681.24 0.73 1955.73 ALL DIP 83.92 7552.80 0.14 1051.02 1.49 0.85 59.79 8131.44 0.13 1096.45 ALL PEA D. 54 48.69 8.33 405.72 41.77 29.25 2.05 278.80 5.25 1463 . 68 ALL OTHER 7.36 662.40 - 282. 74 30.51 14.65 18.44 2507.84 - 559 . 96 ALL PLASTIC 84.~S 7554.28 0.12 885.19 8.62 18.59 84.09 11436.92 0.18 2076.17 ALL CERAMIC 14.42 1297.66 0.95 1236.28 4.18 16.99 11.71 1592.56 1.70 2709.46 ALL OTHER 1.53 137.70 - 157 .41 32.85 13.01 4. 19 569.84 - 290.20 ALL IC PACKAGES 100.00 9000.00 0.25 2278.89 8.61 17.37 100.00 13600.00 0.37 5075.83 ACT = actua l ASP = average sa le pr i ce - = not appl icable or data not ANN GR = anr~ual growth rate EST = est imated MIL = million aYai fable *Copyr i ght 1988 Welterlen, Inc. La Jo l l a, CA

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Representative terms from entire chapter:

flat pack