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Appendix B S OME INDUS TRY COMPONENT DATA The three tables that follow contain some specific industry data from a copyrighted report "Chip Carriers and Other Integrated Circuit Packages: A Review and Update, 1988" prepared by Welterlen, Inc. for client companies. These data are fraction of the comprehensive analysis covered in these annual reports and are presented here with the kind permission of Dr. James W. Welterlen, President of Welterlen, Inc. The tables illustrate the complexity of the chip encapsulation situation. 109
111 Table B-1 DISTRIBUTION OF PACKAGE TYPES* ACT 1987 92/87 92/87 EST 1992 UNIT UNITS ASP VALUE ANN GR ANN GR UNIT UNITS ASP VALUE X MIL ~mil S UNIT % VALUE % % MIL S MIL $ CH I P CARR I ERS: CERAMIC MULTILYR LDL£SS 1.15103.50 1.54159.39 7.65 9.42 1.10149.60 1.67249.95 CERAMIC ttiJLTILYR LEADED 0.3531.50 3.30103.95 45.30 40.51 1.50204.00 2.79569.32 CERAMIC SLAM LEADLESS 0.26 23. 13 O.39 8.91 8.01 9.60 0.25 34.00 0.41 14.08 CERAMIC SLAM LEADED 0.02 1.59 2.50 3.96 47.00 41. 12 O. 08 10.88 2.04 22.18 CERAMIC SLAM ARRAYS O .20 18. 00 0.33 5.94 35. 30 31. 65 0.60 81. 60 0. 29 23 .49 CERQUAD LEADED 0.23 21.0S 0.50 10.42 45.23 40.45 1.00 136.00 0.42 56.93 CERAMIC FINE PITCH 0. 03 2.29 13.50 30. 91 60.62 49.05 0.18 24.48 9.29 227.40 PLASTIC PREMOLDED LEADED 0.08 6.93 1 .30 9 .01 -39 .89 -34 . 18 O .00 O. 54 2. 05 1 . 11 PLASTIC POSTMOLD LEADED S.75 517.50 0.39 199.24 23.65 22.04 11.00 1496.00 0.36 539.33 PLASTIC QUAD FLAT PACK 0.11 10.17 0.75 7.63 121.65 101.26 4.00 544.00 0.46 251.85 PLASTIC LEADLESS 0.00 0.09 0.64 0.06 8.61 7.17 O. 00 O. 14 0.60 0.08 DUAL - I NL I NE - PACKAGE: CERAMIC SIDE BRAZE DIP 1.62 145.80 2.00 291.60 -4.54 -0.93 0.85 115.60 2.41 278.31 CERDIP 9.80 882.00 0.21 185.22 -4.69 -1.61 5.10 693.60 0.25 170.77 PLASTIC POSTMOLDED O}P 72. 50 6525. 00 0 . 09 574. 20 2.33 2.43 53 .84 7322 . 24 0. 09 647 .37 PIN GRID ARRAY: CERAMIC MULTILAYER 0.45 40.24 9.15 368.20 24.92 22.78 0.90 122.40 8.39 1027.39 CERAMIC SLAM 0.04 3.36 5.17 17.39 15.12 14.67 0.05 6.80 5.07 34.47 PLASTIC MIJLTILAYER 0.06 5.08 3.96 20.13 96.67 81.98 1.10 149.60 2.69 401.82 CERAMIC FLAT PACK 0.28 25.20 2.00 50.40 -11 .61 -6.95 0. 10 13.60 2.58 35. 15 PLASTIC SOIC ~ 55 499.50 C.15 74.93 30.96 25.64 14.15 1924.40 0.12 234.61 TAB 0.30 27.00 0.33 8.91 58.72 48.18 2.00 272.00 0.23 63.64 COB ~ . so 45. 00 0.26 11.70 24.76 20.20 1. 00 136.00 0.22 29.35 METAL PLATFORM TYPE 0.04 3.60 10.00 36.00 8.61 8.61 0.04 5.44 10.00 54.40 FETAL FLAT PACK TYPE 0.16 14.40 7.00 100.80 7.21 7.21 0.15 20.40 7.00 142.80 OTHER D. 53 47.70 - - - - 1.00 136. 00 ALL CC 8. 17 735. 74 ~ .73 539 .41 29.52 29.38 19. 72 2681.24 0.73 1955.73 ALL DIP 83.92 7552.80 0.14 1051.02 1.49 0.85 59.79 8131.44 0.13 1096.45 ALL PEA D. 54 48.69 8.33 405.72 41.77 29.25 2.05 278.80 5.25 1463 . 68 ALL OTHER 7.36 662.40 - 282. 74 30.51 14.65 18.44 2507.84 - 559 . 96 ALL PLASTIC 84.~S 7554.28 0.12 885.19 8.62 18.59 84.09 11436.92 0.18 2076.17 ALL CERAMIC 14.42 1297.66 0.95 1236.28 4.18 16.99 11.71 1592.56 1.70 2709.46 ALL OTHER 1.53 137.70 - 157 .41 32.85 13.01 4. 19 569.84 - 290.20 ALL IC PACKAGES 100.00 9000.00 0.25 2278.89 8.61 17.37 100.00 13600.00 0.37 5075.83 ACT = actua l ASP = average sa le pr i ce - = not appl icable or data not ANN GR = anr~ual growth rate EST = est imated MIL = million aYai fable *Copyr i ght 1988 Welterlen, Inc. La Jo l l a, CA
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