Items in cart [1] Questions? Call 888-624-8373

PAPERBACK list:$19.00 Web:$17.10 add to cart PDF BOOK your price: $15.00 add to cart Rights & Permissions Free Resources PDF EXECUTIVE SUMMARY Display this book on your site! Related Titles Condensed-Matter and Materials Physics: The Science of the World Around Us Getting Up to Speed: The Future of Supercomputing Other Related Titles Materials for High-Density Electronic Packaging and Interconnection (1990) National Materials Advisory Board (NMAB) Web Search Builder Use this book's key terms to search within this book, across our collection, or across the Web. Skim This Chapter Skim this chapter and use this chapter's key terms to search within this book. Reference Finder Paste in your own text to find books that relate to your topic. Page 115   E-mail  Facebook  Digg  Stumble  Twitter More Page 115 FRONT MATTER (R1-R14) EXECUTIVE SUMMARY (1-8) 1 INTRODUCTION (9-20) 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS (21-40) 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS (41-58) 4 MATERIALS ISSUES (59-70) 5 SOME SPECIFIC MATERIALS (71-94) 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES (95-104) APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT (105-108) APPENDIX B: SOME INDUSTRY COMPONENT DATA (109-114) APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS (115-118) APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES (119-122) APPENDIX E: MATERIALS PROPERTIES (123-126) APPENDIX F: EXAMPLES OF MULTICHIP MODULES (127-134) APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS (135-139)

Below are the first 10 and last 10 pages of uncorrected machine-read text (when available) of this chapter, followed by the top 30 algorithmically extracted key phrases from the chapter as a whole.
Intended to provide our own search engines and external engines with highly rich, chapter-representative searchable text on the opening pages of each chapter. Because it is UNCORRECTED material, please consider the following text as a useful but insufficient proxy for the authoritative book pages.

Do not use for reproduction, copying, pasting, or reading; exclusively for search engines.

OCR for page 115
Appendix C MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS Progress in operating and structural parameters of microprocessors has been rapid in recent years. The progress and future projections are shown in the accompanying figures, C-l through C-4. These figures were prepared from information drawn from trade journals, forecasting reports, and the direct knowledge of committee members of developments in the field. It should be clear that predictions beyond 10 years are hazardous, at best. 115

OCR for page 116

OCR for page 117
117 100 20 10 3 3 2 1 0.5 0.2 0.1 _ I I I I I I I I I I I I I i i.: I.. ~ ..:~: ~ . I.:.. :'. a:: ~ :.: ~ _: : 1 1 _ ·. ,~ 1 1 1 1 1 980 1 990 YEAR Figure C-1 Microprocessor power requirements: 103 9 8 7 6 5 4 3 2 ~ 102 _ 9 8 7 6 5 4 3 2 1 2000 history and forecast 1 1 o 1 1980 1 990 YEAR 2000 Figure C-2 Microprocessor lead count (I/O): history and forecast.

OCR for page 118
118 107 1o6 105 C, 104 103 ~ 1 1 1 o 2 1980 1 990 2000 YEAR Figure C-3 Microprocessor gate count: history and forecast. 109 8 6 4 3 2 1o8 8 _ ^ 6 _ I, 4 _ ~ 3 _ y 2 _ O 107 _ 8 6 4 3 2 1o6 1 1 1 1 1 1 1 1 1 1 1 1 - 1 1 1 1 1 1 1 1 1 1 1 1 2000 1 980 YEAR 1 990 Figure C-4 Microprocessor clock rate: history and forecast

Representative terms from entire chapter:

microprocessor operating