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PAPERBACK list:$19.00 Web:$17.10 add to cart PDF BOOK your price: $15.00 add to cart Rights & Permissions Free Resources PDF EXECUTIVE SUMMARY Display this book on your site! Related Titles Condensed-Matter and Materials Physics: The Science of the World Around Us Getting Up to Speed: The Future of Supercomputing Other Related Titles Materials for High-Density Electronic Packaging and Interconnection (1990) National Materials Advisory Board (NMAB) Web Search Builder Use this book's key terms to search within this book, across our collection, or across the Web. Skim This Chapter Skim this chapter and use this chapter's key terms to search within this book. Reference Finder Paste in your own text to find books that relate to your topic. Page 119   E-mail  Facebook  Digg  Stumble  Twitter More Page 119 FRONT MATTER (R1-R14) EXECUTIVE SUMMARY (1-8) 1 INTRODUCTION (9-20) 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS (21-40) 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS (41-58) 4 MATERIALS ISSUES (59-70) 5 SOME SPECIFIC MATERIALS (71-94) 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES (95-104) APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT (105-108) APPENDIX B: SOME INDUSTRY COMPONENT DATA (109-114) APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS (115-118) APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES (119-122) APPENDIX E: MATERIALS PROPERTIES (123-126) APPENDIX F: EXAMPLES OF MULTICHIP MODULES (127-134) APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS (135-139)

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OCR for page 119
Appendix D 1 EXAMPLES OF DEVELOPMENTS IN BOW TECHNOLOGIES Various technologies have been developed for assembling complex circuits employing novel circuit and interconnect designs. Some objectives include attempts to minimize the interconnect lengths and make manufacturing reasonably simple, with the possibility of disassembly for repair and circuit changes Two of these are shown in the accompanying figures, D-1 and D-2, based on sketches furnished by TRW. 119

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121 HIGH SPEED SIGNAL PROCESSOR .. FUNCTIONAL UNIT l/o BASE PLATE At\ "~EAT EXCHANGER" ICOLO PLATE OR 5.6 IN. ~ 9 ·l] ; EQUIVALENT) ~ ~ ~ _ a/ ~ i k~ ~ SPACER ~ ~ SUPER He ' HEAT SINK ' BMAOSUENT~G it; CONDUCTIVE PLUGS at. GOLD PLATED C - . ~ a. -CONTACT ~SURf ACE INSULATOR SPACER BOARD BUTTONS I ._ COMBINATION BUTTON BOARD SPACER (ALTERNATE CONfl0) (0.144 THICK) INTERCONNECT MULTILAYER BOARD (UNPOPULATED) (TEFLON GLASS) BOARD SPACER (0 080 THICK) BUTTON BOARDS TYPICAL (0.032 THICK) / CLAMP STRUCTURE BOI ~ (TYP) Figure D-1 Circuit assembly employing button board technology for face-to- face interconnection of modules. (Courtesy of TRW) FORCE / 2 SIDED PC BOARD . , BUTTON ~' BCOTA8ROAR: FORCE ~ PC 50ARD 2 SiOED PC BOARD 1 ~ PLATED FoRCE THRU HOLES PLATED THRU HOLES Figure D-2 Button board interconnection concept developed by TRW. (Courtesy of TRW)

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thru holes