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--> Appendix A: Acronyms and Abbreviations AFM atomic force microscopy BEOL back end of the line CARS coherent anti-Stokes Raman scattering CD critical dimension CFM contamination-free manufacturing CMOS complementary metal oxide semiconductor CVD chemical vapor deposition DFWM degenerate four-wave mixing DRAM dynamic random access memory ECR electron cyclotron resonance E/N ratio of electric field to gas density FOM Fundamenteel Onderzoek der Materie (a research institute in the Netherlands) FTIR Fourier transform infrared FTMS Fourier transform mass spectroscopy IC integrated circuit ICP inductively coupled plasma IR infrared IRIS imaging of radicals interacting with surfaces JANAF Joint Army-Navy-Air Force Kn Knudsen number LIF laser-induced fluorescence MD molecular dynamics MOSFET metal oxide semiconductor field effect transistor MPU microprocessor unit NIST National Institute of Standards and Technology PECVD plasma-enhanced chemical vapor deposition PVD physical vapor deposition rf radio frequency RIE reactive ion etching SEM scanning electron microscopy SEP stimulated emission pumping SIA Semiconductor Industry Association SPIE The International Society for Optical Engineering TALIF two-photon allowed laser-induced fluorescence TEM transmission electron microscopy TEOS tetraethoxysilane UHV ultrahigh vacuum ULSI ultralarge-scale integration UV ultraviolet VLSI very large scale integration
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