COMMITTEE ON ADVANCED MATERIALS AND FABRICATION METHODS FOR MICROELECTROMECHANICAL SYSTEMS

RICHARD S. MULLER (chair),

University of California, Berkeley

MICHAEL ALBIN,

The Perkin-Elmer Corporation, Foster City, California

PHILLIP W. BARTH,

Hewlett-Packard Laboratories, Palo Alto, California

SELDEN B. CRARY,

University of Michigan, Ann Arbor

DENICE D. DENTON,

University of Washington, Seattle

KAREN W. MARKUS,

MEMS Technology Applications Center at MCNC, Research Triangle Park, North Carolina

PAUL J. MCWHORTER,

Sandia National Laboratories, Albuquerque, New Mexico

ROBERT E. NEWNHAM,

Pennsylvania State University, University Park

RICHARD S. PAYNE,

Analog Devices, Inc., Cambridge, Massachusetts

National Materials Advisory Board Staff

ROBERT M. EHRENREICH, Senior Program Officer

PAT WILLIAMS, Senior Project Assistant

CHARLES HACH, Research Associate

JOHN A. HUGHES, Research Associate

BONNIE A. SCARBOROUGH, Research Associate

Technical Consultants

GEORGE M. DOUGHERTY,

U.S. Air Force, Wright Patterson Air Force Base, Ohio

JASON HOCH,

MEMS Technology Applications Center at MCNC, Research Triangle Park, North Carolina

HOWARD LAST,

Naval Surface Warfare Center, Silver Spring, Maryland

NOEL C. MACDONALD,

Defense Advanced Research Projects Agency, Arlington, Virginia

Liaison Representatives

KEN GABRIEL,

Defense Advanced Research Projects Agency, Arlington, Virginia

CARL A. KUKKONEN,

Jet Propulsion Laboratory, Pasadena, California

WILLIAM T. MESSICK,

Naval Surface Warfare Center, Silver Spring, Maryland

DAVID J. NAGEL,

Naval Research Laboratory, Washington, D.C.

JOHN PRATER,

Army Research Office, Research Triangle Park, North Carolina

RICHARD WLEZIEN,

NASA Langley Research Center, Hampton, Virginia

National Materials Advisory Board Liaison

LIONEL C. KIMERLING,

Massachusetts Institute of Technology, Cambridge



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