Appendix D
Acronyms and Abbreviations
AC—
alternating current
ACSL—
Advanced Chemical Sciences Laboratory
ADAHF—
American Dental Association Health Foundation
AEC—
architecture-engineering-construction
AES—
Advanced Encryption Standard
AES—
Auger electron spectroscopy (spectrometer)
AHP—
analytical hierarchy process
AIS—
advanced insulation system
ALOFT—
A Large Outdoor Fire Plume Trajectory (model)
AMCIT—
Advanced Measurement Center for Information Technology
AML—
Advanced Measurement Laboratory
AMSANT—
Advanced Manufacturing Systems and Networking Testbed
APTD—
Automated Production Technology Division
ASHRAE—
American Society of Heating, Refrigerating, and Air-conditioning Engineers
ASTM—
American Society for Testing and Materials
ATM—
asynchronous transfer mode
ATP—
Advanced Technology Program
BACnet—
Building Automation and Controls Network
BEC—
Bose-Einstein condensation
BEES—
Building for Environmental and Economic Sustainability
BFRL—
Building and Fire Research Laboratory
BLAS—
Basic Linear Algebra Subprograms
BMCD—
Biological Macromolecule Crystallization Database
BT—
beam tube
CAD—
computer-aided design
CALS—
Continuous Acquisition and Life-cycle Support
CAM—
computer-aided manufacturing
CARB—
Center for Advanced Research in Biotechnology
CBS—
Cybernetic Building Systems
CC—
common criteria
CFC—
chlorofluorocarbon
CFD—
computational fluid dynamics
CHRNS—
Center for High-Resolution Neutron Scattering
CICE—
computer-integrated construction environment(s)
CIKS—
Computer-Integrated Knowledge System(s)
CIRMS—
Council on Ionizing Radiation Measurements and Standards
CKMech—
chemical kinetic mechanisms database
CMM—
coordinate measuring machine
CMOS—
complementary metal oxide semiconductor
CNRF—
Cold Neutron Research Facility
CODATA—
Committee on Data for Science and Technology
CONTAM—
a multizone indoor air-quality model designed to track airflow and contaminant dispersal
CRADA—
Cooperative Research and Development Agreement
CRDS—
cavity ring-down spectroscopy
CSTL—
Chemical Science and Technology Laboratory
CTCMS—
Center for Theoretical and Computational Materials Science
CVD—
chemical vapor deposition
CW—
continuous wave
CWC—
Chemical Weapons Convention
D/H—
deuterium to hydrogen ratio
DARPA—
Defense Advanced Research Projects Agency
DARTS—
double-axis residual stress/single-crystal diffractometer
DCISD—
Distributed Computing and Information Services Division
DMD—
differential mode delay
DVD—
digital video disk
EC—
electronic commerce
EDFA—
erbium-doped fiber amplifier
EDS—
energy dispersive spectrometer
EEEL—
Electronics and Electrical Engineering Laboratory
EFT—
electronic funds transfer
EMF—
electromagnetic field
EPA—
Environmental Protection Agency
ESD—
electrostatic discharge
EUV—
extreme ultraviolet
FDA—
Food and Drug Administration
FDD—
fault detection and diagnosis
FedCIRC—
Federal Computer Incident Response Capability
FM—
frequency modulation
FT—
Fourier transform
FTIR—
Fourier transform infrared
FTP—
full-time permanent
GAMS—
Guide to Available Mathematical Software
GC/MS—
gas chromatography/mass spectrometry
GHRS—
Goddard high-resolution spectrometer
GMR—
giant magnetoresistance
GPS—
Global Positioning System
HCFC—
hydrochlorofluorocarbon
HFC—
hydrofluorocarbon
HPC—
high-performance computing
HPCC—
high-performance computing and communications
HPSSD—
High Performance Systems and Services Division
HTS—
high-temperature superconductive
HST—
Hubble Space Telescope
HVAC—
heating, ventilation, and air conditioning
IAQ—
indoor air quality
ICP-MS—
inductively coupled plasma mass spectroscopy
ICP-OES—
inductively coupled plasma-optical emission spectrometry
ICSSC—
Interagency Committee on Seismic Safety in Construction
IEC—
International Electrotechnical Commission
IEEE—
Institute of Electrical and Electronics Engineers
IETF—
Internet Engineering Task Force
IMPI—
interoperable message passing interface
IP—
Internet Protocol
IPsec—
Internet Security Protocol
IR—
infrared
ISD—
Intelligent Systems Division
ISO—
International Organization for Standardization
IT—
information technology
ITL—
Information Technology Laboratory
ITS-90—
International Temperature Scale of 1990
LC—
liquid chromatography
LCC—
life-cycle cost
LFPG—
low-frost-point generator
MALDI—
matrix-assisted laser desorption ionization
MCSD—
Mathematical and Computational Sciences Division
MEL—
Manufacturing Engineering Laboratory
MEMS—
microelectromechanical systems
MEP—
Manufacturing Extension Partnership
MIRF—
Medical-Industrial Radiation Facility
MMIC—
microwave monolithic integrated circuit
MOIST—
moisture flow analysis software
MR—
magnetic resonance
MS—
mass spectrometry
MSEL—
Materials Science and Engineering Laboratory
MSID—
Manufacturing Systems Integration Division
NAAQS—
National Ambient Air Quality Standards
NAMT—
National Advanced Manufacturing Testbed
NASA—
National Aeronautics and Space Administration
NCNR—
NIST Center for Neutron Research
NFG—
nonfederal government
NHPS—
National Network for High Performance Seismic Simulation
NIAP—
National Information Assurance Partnership
NICE-OHMS—
Noise-Immune Cavity-Enhanced Optical Heterodyne Molecular Spectroscopy
NIDR—
National Institute of Dental Research
NIH—
National Institutes of Health
NMR—
nuclear magnetic resonance
NOAA—
National Oceanic and Atmospheric Administration
NSF—
National Science Foundation
NSMP—
National Semiconductor Metrology Program
NSOM—
near-field scanning optical microscopy
NSTC—
National Science and Technology Council
NTRM—
NIST Traceable Reference Materials
NTRS—
National Technology Roadmap for Semiconductors
OA—
other agency
OAE—
Office of Applied Economics
OIDA—
Optoelectronics Industry Development Association
OLES—
Office of Law Enforcement Standards
OMP—
Office of Microelectronics Programs
Open/GL—
open/graphics language
PAC—
Program Advisory Committee
PED—
Precision Engineering Division
PET—
positron emission tomography
PHPCT—
Partnership for High-Performance Concrete Technology
PKI—
public-key infrastructure
PlantSTEP—
the use of STEP for exchange of plant engineering information
RCS—
radar cross section
REFPROP—
refrigerant properties
RF—
radio frequency
Rs—
surface resistance
RTM—
resin transfer molding
SANS—
small-angle neutron scattering
SCALPEL—
scattering with angular limitation projection electron-beam lithography
SED—
Statistical Engineering Division
SEM—
scanning electron microscopy
SEMATECH—
Semiconductor Manufacturing Technology (consortium)
SEMPA—
scanning electron microscopy with polarization analysis
SET—
single-electron tunneling
SFG—
sum frequency generation
SI—
International System of Units
SIA—
Semiconductor Industry Association
SIM—
Inter-American System for Metrology
SIMS—
secondary ion-mass spectrometry
SNS—
spallation neutron source
SPINS—
spin polarized inelastic neutron scattering
SRD—
Standard Reference Data
SRIM—
structural reaction injection molding
SRMs—
Standard Reference Materials
SRR—
social rate of return
STEP—
standard for the exchange of product model data
STM—
scanning tunneling microscopy
StRD—
statistical reference dataset
STRs—
short tandem repeats
STRS—
Scientific and Technical Research and Services
SURF—
Synchrotron Ultraviolet Radiation Facility
TBC—
thermal barrier coating
Tc—
critical temperature
U.S. NRC—
U.S. Nuclear Regulatory Commission
UV—
ultraviolet
VAMAS—
Versailles Project on Advanced Materials and Standards
VM—
virtual machine
VRML—
Virtual reality modeling language
V-t—
voltage time
WD-XRF—
wavelength dispersive x-ray fluorescence
XPS—
x-ray photoelectron spectroscopy (spectrometer)