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Appendix F Sample Fabrication Sequence for a Standard Printed Circuit Board
Pages 77-82

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From page 77...
... Photoresist is a coating of photosensitive material to be used to place the image of the inner-layer circuit pattern on the clad material. _______________________ NOTE: The figures and text in this appendix are drawn from educational materials available at http://www.rockwellcollins.com/about/additionalproducts/collinsprintedcircuits/making_circuit_boards/index.html and are used by permission from Rockwell Collins, Cedar Rapids, Iowa.
From page 78...
... Inner Circuitry Etch is the chemical process that removes the unwanted copper in order to define the circuit image. The etch process will not attack the copper protected by the photoresist.
From page 79...
... Electroless copper chemically plates an initial thin copper layer over the whole panel surface. This provides a surface that can now be electrically plated, which will provide a thicker amount of copper to build a tublet-type hole.
From page 80...
... The only steps remaining are those of finishing the surface requirements, creating the mechanical size features, and the final inspecting. Photo Expose and Strip Tin-Lead The tin-lead strip process involves cleaning the panel, laminating the photoresist on the panel, exposing and developing a pattern to selectively strip the tin-lead.
From page 81...
... Planar deposits help placement and soldering of tiny components. Identification A silkscreen legend is either a customer requirement for component identification, or it is completed by the printed circuit board supplier and used for board identification.


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