Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS
APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS
Pages 135-139
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From page 135... ...
He is a member of the American Chemical Society and American Institute of Chemical Engineers and is also a member and fellow of the American Physical Society, the American Association for the Advancement of Science, and the Royal Society of Chemists. In 1984 he was elected to the National Academy of Engineering and has served on a number of Academy study programs.
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From page 136... ...
He is a member of the American Physiological Society and the Institute of Electrical and Electronics Engineers and has served on the Materials Research Council of the Defense Advanced Research Analysis Agency since 1985. His areas of expertise include applications of engineering and computational methods to biomedical research and clinical medicine, design of high-performance signal processors, development of computer-aided design software for signal processors, and integrated circuit design.
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From page 137... ...
In 1980 he received the International Award of the Society of Plastics Engineers, and in 1989 he was elected to the National Academy of Engineering. He is a member of the American Chemical Society and the Society of Rheology and a member and fellow of the American Phys ical Society and the Society of Plastics Engineers .
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From page 138... ...
In 1971 he was visiting professor at Cornell University. He is a member of the Society of the Sigma Xi and a member and fellow of the American Physical Society and the American Institute of Chemists.
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From page 139... ...
In 1984 he joined the Microelectronics and Computer Technology Corporation as vice president and director of the MCC semiconductor packaging and interconnection program. He has served on numerous university' professional society, and government boards and panels and was technical advisor to the Packard Commission.
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