Skip to main content

Unit Manufacturing Processes Issues and Opportunities in Research (1995) / Chapter Skim
Currently Skimming:

8 Integrated Processes
Pages 111-118

The Chapter Skim interface presents what we've algorithmically identified as the most significant single chunk of text within every page in the chapter.
Select key terms on the right to highlight them within pages of the chapter.


From page 111...
... The experience of the microelectronics industry is that the development of integrated processing tools has been constrained by many factors, including high development cost, limited range of process expertise at a typical equipment vendor, unknown market requirements, and lack of industry-wide equipment interface standards. ~ The Modular Equipment Standards Committee of Semiconductor Equipment and Materials International was formed to develop standards for mechanical, utility, software, and control interfaces for future integrated processing systems.
Read the entire page →
From page 112...
... Atomic and molecular material beam technologies of interest include physical vapor deposition (direct evaporation processes, direct reactive evaporation processes, direct sputtering, reactive sputtering, ion beam sputtering) molecular-beam epitaxy, chemical vapor deposition, microwave plasmas, ion beams, and directed-energy beams (electron, laser, x-ray, and microwave)
Read the entire page →
From page 113...
... In integrated-circuit chip making, the goal is to produce a localized change in electrical properties. Table 8-1 Comparison of Processes to Produce Precision Gears CONVENTIONAL PROCESS INTEGRATED PROCESS - A low-carbon steel preform is initially rough machined into a gear blank.
Read the entire page →
From page 114...
... For example, a relatively inexpensive mild carbon steel could be processed to have the corrosion resistance of a much higher priced stainless steel by effectively forming a thin surface layer of stainless steel. Alloying material can be either predeposited on the surface in a separate step prior to laser treatment or codeposited by- injection into the melt at the time of laser treatment.
Read the entire page →
From page 115...
... Standards must be developed that address mechanical, utility, software, and control interfaces between unit processes that are candidates for integration (similar to the effort currently underway by the Modular Equipment Standards Committee of Semiconductor Equipment and Materials International)
Read the entire page →
From page 116...
... 116 Unit Manufacturing Processes: Issues and Opportunities in Research · Control architectures. Other future directions for research include the development of new or improved lasers and control systems that provide a high degree of dimensional accuracy and production tolerance.
Read the entire page →
From page 117...
... 1990. Laser surface treatments for promoting corrosion resistance of carbon steel.
Read the entire page →

Key Terms

  • integrated processes
  • unit processes
  • integrated process
  • unit process
  • beam technologies

  • carbon steel
  • mixing chamber
  • equipment standards
  • gear blank
  • vapor deposition

  • stainless steel
  • laser surface
  • evaporation processes
  • control interfaces
  • individual unit

  • modular equipment
  • single piece
  • process parameters
  • corrosion resistance
  • standards committee

  • surface layer
  • materials international
  • process steps
  • laser treatment
  • semiconductor equipment

  • temporal energy
  • integrating multiple
  • machine tools
  • laser melts
  • energy intensity


    • This material may be derived from roughly machine-read images, and so is provided only to facilitate research.
    More information on Chapter Skim is available.